Motalab, M: шукати на сайті Z-Library

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[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales - Viscoplastic Constitutive Model for Lead-Free Solder Including Effects of Silver Content, Solidification Profile, and Severe Aging

Basit, Munshi, Motalab, Mohammad, Suhling, Jeffrey C., Lall, Pradeep

Рік:

2015

Мова:

english

Файл:

PDF, 3.32 MB

english, 2015

[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Determination of Anand constants for SAC solders using stress-strain or creep data

Motalab, Mohammad, Cai, Zijie, Suhling, Jeffrey C., Lall, Pradeep

Рік:

2012

Мова:

english

Файл:

PDF, 1.14 MB

english, 2012

Atomistic analysis to characterize the impact of temperature and defects on the mechanical properties of germanene sheet

Paul, Ratul, Tasnim, Tamanna, Saha, Sourav, Motalab, Abdul

Журнал:

Materials Research Express

Рік:

2018

Мова:

english

Файл:

PDF, 2.93 MB

english, 2018

Characterization of Compressive Die Stresses in CBGA Microprocessor Packaging Due to Component Assembly and Heat Sink Clamping

Roberts, Jordan C., Motalab, Mohammad, Hussain, Safina, Suhling, Jeffrey C., Jaeger, Richard C., Lall, Pradeep

Журнал:

Journal of Electronic Packaging

Рік:

2012

Мова:

english

Файл:

PDF, 18.44 MB

english, 2012

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Improved predictions of lead free solder joint reliability that include aging effects

Motalab, Mohammad, Cai, Zijie, Suhling, Jeffrey C., Zhang, Jiawei, Evans, John L., Bozack, Michael J., Lall, Pradeep

Рік:

2012

Мова:

english

Файл:

PDF, 1.91 MB

english, 2012

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Creep test method for determination of Anand parameters for lead free solders and their variation with aging

Motalab, Mohammad, Basit, Munshi, Suhling, Jeffrey C., Bozack, Michael J., Lall, Pradeep

Рік:

2014

Мова:

english

Файл:

PDF, 1.15 MB

english, 2014

Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors

Jaeger, Richard C., Motalab, Mohammad, Hussain, Safina, Suhling, Jeffrey C.

Журнал:

Journal of Electronic Packaging

Рік:

2014

Мова:

english

Файл:

PDF, 1.99 MB

english, 2014

[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes - A Revised Anand Constitutive Model for Lead Free Solder That Includes Aging Effects

Motalab, Mohammad, Basit, Munshi, Suhling, Jeffrey C., Lall, Pradeep

Рік:

2013

Мова:

english

Файл:

PDF, 3.04 MB

english, 2013

AIP Conference Proceedings [Author(s) INTERNATIONAL CONFERENCE ON MECHANICAL ENGINEERING: Proceedings of the 11th International Conference on Mechanical Engineering (ICME 2015) - Dhaka, Bangladesh (18–20 December 2015)] - Constitutive modeling of the human Anterior Cruciate Ligament (ACL) under uniaxial loading using viscoelastic prony series and hyperelastic five parameter Mooney-Rivlin model

Chakraborty, Souvik, Mondal, Debabrata, Motalab, Mohammad

Рік:

2016

Мова:

english

Файл:

PDF, 1.04 MB

english, 2016

Strain rate and curing condition effects on the stress–strain behaviour of epoxy adhesive materials

Paul, Shiddartha, Motalab, Mohammad, Zubaer, M. Ali, Hossain, M. Zakir

Журнал:

Journal of Adhesion Science and Technology

Рік:

2017

Мова:

english

Файл:

PDF, 4.61 MB

english, 2017

[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales - FEA Based Reliability Predictions for PBGA Packages Subjected to Isothermal Aging Prior to Thermal Cycling

Basit, Munshi, Motalab, Mohammad, Suhling, Jeffrey C., Evans, John L., Lall, Pradeep

Рік:

2015

Мова:

english

Файл:

PDF, 2.95 MB

english, 2015

Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ]

Jaeger, Richard C., Motalab, Mohammad, Hussain, Safina, Suhling, Jeffrey C.

Журнал:

Journal of Electronic Packaging

Рік:

2018

Файл:

PDF, 115 KB

2018

[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - The Anand parameters for SAC solders after extreme aging

Basit, Munshi, Ahmed, Sudan, Motalab, Mohammad, Roberts, Jordan C., Suhling, Jeffrey C., Lall, Pradeep

Рік:

2016

Мова:

english

Файл:

PDF, 557 KB

english, 2016

Inherent mechanical properties of bilayer germanene coupled by covalent bonding

Arshee, Mahmuda Raakib, Adnan, Saqeeb, Motalab, Mohammad, Bose, Pritom

Журнал:

RSC Advances

Рік:

2019

Файл:

PDF, 3.96 MB

2019

Thermal hydraulic transient study of 3 MW TRIGA Mark-II research reactor of Bangladesh using the EUREKA-2/RR code

N.H. Badrun, M.H. Altaf, M.J.H. Khan, M.S. Mahmood, M.A. Motalab, Z.I. Lyric

Журнал:

Annals of Nuclear Energy

Рік:

2012

Мова:

english

Файл:

PDF, 1.15 MB

english, 2012

A study on TRIGA core reconfiguration with new irradiation channels

Zoairia Idris Lyric, Mohammad Sayem Mahmood, Mohammad Abdul Motalab

Журнал:

Annals of Nuclear Energy

Рік:

2012

Мова:

english

Файл:

PDF, 681 KB

english, 2012

Benchmark analysis of SPERT-IV reactor with Monte Carlo code MVP

Motalab, M.A., Mahmood, M.S., Khan, M.J.H., Badrun, N.H., Lyric, Z.I., Altaf, M.H.

Журнал:

Annals of Nuclear Energy

Рік:

2014

Мова:

english

Файл:

PDF, 544 KB

english, 2014

Optimum burnup of BAEC TRIGA research reactor

Lyric, Zoairia Idris, Mahmood, Mohammad Sayem, Motalab, Mohammad Abdul, Khan, Jahirul Haque

Журнал:

Annals of Nuclear Energy

Рік:

2013

Мова:

english

Файл:

PDF, 564 KB

english, 2013

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Correlation of reliability models including aging effects with thermal cycling reliability data

Motalab, Mohammad, Mustafa, Muhannad, Suhling, Jeffrey C., Zhang, Jiawei, Evans, John, Bozack, Michael J., Lall, Pradeep

Рік:

2013

Мова:

english

Файл:

PDF, 1.71 MB

english, 2013

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - The effects of aging on the Anand viscoplastic constitutive model for SAC305 solder

Basit, Munshi M., Motalab, Mohammad, Suhling, Jeffrey C., Lall, Pradeep

Рік:

2014

Мова:

english

Файл:

PDF, 1.37 MB

english, 2014

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Characterization of microprocessor chip stress distributions during component packaging and thermal cycling

Roberts, Jordan, Hussain, Safina, Rahim, M. Kaysar, Motalab, Mohammad, Suhling, Jeffrey C., Jaeger, Richard C., Lall, Pradeep, Zhang, Ron

Рік:

2010

Мова:

english

Файл:

PDF, 4.47 MB

english, 2010

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - The effects of silver content and solidification profile on the Anand constitutive model for SAC lead free solders

Basit, Munshi M., Motalab, Mohammad, Roberts, Jordan C., Suhling, Jeffrey C., Lall, Pradeep

Рік:

2014

Мова:

english

Файл:

PDF, 1.40 MB

english, 2014

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Error analysis for piezoresistive stress sensors used in flip chip packaging

Hussain, Safina, Jaeger, Richard C., Suhling, Jeffrey C., Roberts, Jordan C., Motalab, Mohammad A., Cho, Chun-Hyung

Рік:

2010

Мова:

english

Файл:

PDF, 1.13 MB

english, 2010

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Measurement of die stresses in microprocessor packaging due to thermal and power cycling

Roberts, Jordan, Motalab, Mohammad, Hussain, Safina, Suhling, Jeffrey C., Jaeger, Richard C., Lall, Pradeep

Рік:

2012

Мова:

english

Файл:

PDF, 1.61 MB

english, 2012

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Measurement of die stress distributions in flip chip CBGA packaging

Roberts, Jordan, Hussain, Safina, Rahim, M. Kaysar, Motalab, Mohammad, Suhling, Jeffrey C., Jaeger, Richard C., Lall, Pradeep, Zhang, Ron

Рік:

2010

Мова:

english

Файл:

PDF, 3.11 MB

english, 2010

Borrelia burgdorferi Uniquely Regulates Its Motility Genes and Has an Intricate Flagellar Hook-Basal Body Structure

Sal, M. S., Li, C., Motalab, M. A., Shibata, S., Aizawa, S.-I., Charon, N. W.

Журнал:

Journal of Bacteriology

Рік:

2008

Мова:

english

Файл:

PDF, 847 KB

english, 2008

Thermal cycling reliability of aged PBGA assemblies - comparison of Weibull failure data and finite element model predictions

M. M. Basit, M. Motalab, J. C. Suhling, Z. Hai, J. Evans, M. J. Bozack, P. Lall

Рік:

2015

Мова:

english

Файл:

PDF, 2.14 MB

english, 2015

Evaluation of CANDU6 PCR (power coefficient of reactivity) with a 3-D whole-core Monte Carlo Analysis

Motalab, Mohammad Abdul, Kim, Woosong, Kim, Yonghee

Журнал:

Nuclear Engineering and Design

Рік:

2015

Мова:

english

Файл:

PDF, 2.95 MB

english, 2015

[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes - Thermal Cycling Reliability Predictions for PBGA Assemblies That Include Aging Effects

Motalab, Mohammad, Mustafa, Muhannad, Suhling, Jeffrey C., Zhang, Jiawei, Evans, John, Bozack, Michael J., Lall, Pradeep

Рік:

2013

Мова:

english

Файл:

PDF, 2.48 MB

english, 2013

Improvement of CANDU safety parameters by using the CANFLEX fuel

Kim, Woosong, Motalab, Mohammad Abdul, Bae, Jun Ho, Kim, Yonghee

Журнал:

Annals of Nuclear Energy

Рік:

2016

Мова:

english

Файл:

PDF, 1.51 MB

english, 2016

[IEEE 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) - Raleigh, NC, USA (2016.6.13-2016.6.15)] 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) - Enabling high reliability power modules: A multidisciplinary task

Gonzalez, J. Ortiz, Ran, L., Soli, A. Mohamed Motalab Ali, Davletzhanova, Z., Alatise, O., Mawby, P., Borong Hu,, Zheng Zeng,, Hai Ren,, Li Hui,, Xu, Shengyou

Рік:

2016

Мова:

english

Файл:

PDF, 2.58 MB

english, 2016

[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Improved predictions of cyclic stress-strain curves for lead free solders using the Anand viscoplastic constitutive model

Motalab, Mohammad, Mustafa, Muhannad, Suhling, Jeffrey C., Lall, Pradeep

Рік:

2016

Мова:

english

Файл:

PDF, 1.39 MB

english, 2016

Graphene and its elemental analogue: A molecular dynamics view of fracture phenomenon

Rakib, Tawfiqur, Mojumder, Satyajit, Das, Sourav, Saha, Sourav, Motalab, Mohammad

Журнал:

Physica B: Condensed Matter

Рік:

2017

Мова:

english

Файл:

PDF, 1.61 MB

english, 2017

Investigation on mechanical properties of polycrystalline W nanowire

Saha, Sourav, Abdul Motalab, Mohammad, Mahboob, Monon

Журнал:

Computational Materials Science

Рік:

2017

Мова:

english

Файл:

PDF, 3.52 MB

english, 2017

AIP Conference Proceedings [Author(s) 7TH BSME INTERNATIONAL CONFERENCE ON THERMAL ENGINEERING - Dhaka, Bangladesh (22–24 December 2016)] - Influence of defects on thermal properties of stanene

Das, Sourav, Rakib, Tawfiqur, Mojumder, Satyajit, Islam, Md Mahbubul, Motalab, Mohammad Abdul

Рік:

2017

Мова:

english

Файл:

PDF, 1.02 MB

english, 2017

Evaluating the feasibility of operation and planning practices for mutual benefits of DNOs and power developers

Abd-el-Motalab, A.M., Alvarado Barrios, Lázaro

Журнал:

International Journal of Electrical Power & Energy Systems

Рік:

2018

Мова:

english

Файл:

PDF, 1.22 MB

english, 2018

Atomistic Representation of Anomalies in the Failure Behaviour of Nanocrystalline Silicene

Rakib, Tawfiqur, Saha, Sourav, Motalab, Mohammad, Mojumder, Satyajit, Islam, Md Mahbubul

Журнал:

Scientific Reports

Рік:

2017

Мова:

english

Файл:

PDF, 3.06 MB

english, 2017

[ASME ASME 2017 International Mechanical Engineering Congress and Exposition - Tampa, Florida, USA (Friday 3 November 2017)] Volume 3: Biomedical and Biotechnology Engineering - Effect of Curing Time on the Mechanical Properties of a High Viscous PMMA Cement

Motalab, Mohammad Abdul, Parvej, M. S., Kallol, K. M. Zaman, Khandaker, M.

Рік:

2017

Мова:

english

Файл:

PDF, 1.62 MB

english, 2017

[IEEE TENCON 2017 - 2017 IEEE Region 10 Conference - Penang (2017.11.5-2017.11.8)] TENCON 2017 - 2017 IEEE Region 10 Conference - Study of uniaxial tensile properties of hexagonal boron nitride nanoribbons

Paul, Ratul, Tasnim, Tamanna, Dhar, Rajkumar, Mojumder, Satyajit, Saha, Sourav, Motalab, Mohammad Abdul

Рік:

2017

Мова:

english

Файл:

PDF, 1.73 MB

english, 2017

Atomistic investigation on mechanical properties and fracture mechanism of Indium Phosphide nanowire

Rakib, Tawfiqur, Pial, Turash Haque, Mojumder, Satyajit, Motalab, Mohammad, Akanda, M A Salam

Журнал:

Physical Chemistry Chemical Physics

Рік:

2018

Мова:

english

Файл:

PDF, 3.28 MB

english, 2018

Nature of creep deformation in nanocrystalline Tungsten

Saha, Sourav, Motalab, Mohammad

Журнал:

Computational Materials Science

Рік:

2018

Мова:

english

Файл:

PDF, 2.72 MB

english, 2018

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL (2011.5.31-2011.6.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Squeezing the chip: The buildup of compressive stress in a microprocessor chip by packaging and heat sink clamping

Roberts, Jordan C., Motalab, Mohammad, Hussain, Safina, Suhling, Jeffrey C., Jaeger, Richard C., Lall, Pradeep

Рік:

2011

Мова:

english

Файл:

PDF, 12.97 MB

english, 2011

Modeling of SPERT IV Reactivity Initiated Transient Tests in EUREKA-2/RR Code

Badrun, N. H., Altaf, M. H., Motalab, M. A., Mahmood, M. S., Khan, M. J. H.

Журнал:

International Journal of Nuclear Energy

Рік:

2014

Мова:

english

Файл:

PDF, 1.64 MB

english, 2014

AIP Conference Proceedings [Author(s) DISRUPTIVE INNOVATION IN MECHANICAL ENGINEERING FOR INDUSTRY COMPETITIVENESS: Proceedings of the 3rd International Conference on Mechanical Engineering (ICOME 2017) - Surabaya, Indonesia (5–6 October 2017)] - Shear based analysis of nickel nano-plate by molecular dynamics simulations

Jui, Tamanna Akter, Bose, Pritom, Rakib, Tawfiqur, Mojumder, Satyajit, Motalab, Mohammad

Рік:

2018

Мова:

english

Файл:

PDF, 907 KB

english, 2018

AIP Conference Proceedings [Author(s) DISRUPTIVE INNOVATION IN MECHANICAL ENGINEERING FOR INDUSTRY COMPETITIVENESS: Proceedings of the 3rd International Conference on Mechanical Engineering (ICOME 2017) - Surabaya, Indonesia (5–6 October 2017)] - Temperature and size effect on the mechanical properties of indium phosphide nanowire: An atomistic study

Pial, Turash Haque, Rakib, Tawfiqur, Bose, Pritom, Mojumder, Satyajit, Motalab, Mohammad

Рік:

2018

Мова:

english

Файл:

PDF, 930 KB

english, 2018

AIP Conference Proceedings [Author(s) DISRUPTIVE INNOVATION IN MECHANICAL ENGINEERING FOR INDUSTRY COMPETITIVENESS: Proceedings of the 3rd International Conference on Mechanical Engineering (ICOME 2017) - Surabaya, Indonesia (5–6 October 2017)] - Comparative study of mechanical properties of PP, LDPE and EVA at different molding temperatures

Jhumur, Nandita Chakrabarty, Chakrabarty, Shashwata, Gafur, M. A., Motalab, Mohammad Abdul

Рік:

2018

Мова:

english

Файл:

PDF, 475 KB

english, 2018

Tuning the mechanical properties of silicene nanosheet by auxiliary cracks: a molecular dynamics study

Nahid, Shahriar Muhammad, Nahian, Shahriar, Motalab, Mohammad, Rakib, Tawfiqur, Mojumder, Satyajit, Islam, Md Mahbubul

Журнал:

RSC Advances

Рік:

2018

Мова:

english

Файл:

PDF, 2.70 MB

english, 2018

AIP Conference Proceedings [Author(s) DISRUPTIVE INNOVATION IN MECHANICAL ENGINEERING FOR INDUSTRY COMPETITIVENESS: Proceedings of the 3rd International Conference on Mechanical Engineering (ICOME 2017) - Surabaya, Indonesia (5–6 October 2017)] - Effect of curing time on the mechanical properties of a veterinarian bone cement

Khandaker, M., Parvej, M. S., Kallol, K. M. Zaman, Motalab, Mohammad

Рік:

2018

Мова:

english

Файл:

PDF, 1.14 MB

english, 2018

AIP Conference Proceedings [Author(s) DISRUPTIVE INNOVATION IN MECHANICAL ENGINEERING FOR INDUSTRY COMPETITIVENESS: Proceedings of the 3rd International Conference on Mechanical Engineering (ICOME 2017) - Surabaya, Indonesia (5–6 October 2017)] - Investigation on thermal cycling life prediction of PBGA microprocessor components with wavy patterned interface layer

Hossain, Md. Tanver, Ahmed, Md. Tusher, Motalab, Mohammad, Shakil, Ahmad Shahedi, Kamruzzaman, Md.

Рік:

2018

Мова:

english

Файл:

PDF, 972 KB

english, 2018

Atomistic insights into mechanical and thermal properties of stanene with defects

Das, Sourav, Mojumder, Satyajit, Rakib, Tawfiqur, Islam, Md Mahbubul, Motalab, Mohammad

Журнал:

Physica B: Condensed Matter

Рік:

2018

Мова:

english

Файл:

PDF, 3.28 MB

english, 2018